X410 IR Rework Station - Rework Without The Complications The PDR-X410 SMT/BGA rework system, using PDR™s patented Focused IR technology, has been specifically designed to

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    02-Apr-2018

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X410 IR Rework Stationwww.pdr-smt.com/x410BGA Rework Without The ComplicationsThe PDR-X410 SMT/BGA rework system, using PDRs patented Focused IR technology, has beenspecifically designed to cope with the challenges of repairing todays PCB assemblies.The system is tool free, gas free, instantly/precisely controllable, clean, modular, upgradeable andproduces 100% yield BGA rework without any complications. It provides the extremely high levelsof profiling and process control necessary for the effective rework of even the most advancedpackages, including SMDs, BGAs, CSPs, Flipchips and is ready for 0201 and lead-free applications.The IR-X410 comes with a good range of standard features allowing the operator to quickly andsafely rework all types of components without overheating the component, adjacents or the PCB.It uses all the proven attributes of PDRs Focused IR technology, first introduced in 1987 and nowused worldwide by over 3000 customers.Advanced Features Focused IR Component HeatingPDRs patented technology IR PCB PreheaterLarge area 1200w system Precision Component Placement Low Force Landing and Rotation Component Nest and PasteApplication FacilityPrint Frame X/Y TableMacro-Micro Movement andMicrometer Adjustment Non-Contact IR SensorFor Measuring Component Temperature PC Control PackageWith PDR ThermoActive Software Suite Optional BGA/Micro-BGAAlignmentCCTV/Prism Based SystemX410 IR Rework Stationwww.pdr-smt.com/x410PDR OfficesEurope and AsiaPDRUnit 3 Stanley Centre, Kelvin WayCrawley, West Sussex, RH10 9SEEnglandSalesPhone: +44 1293 846 000Fax: +44 1293 613 600Email: sales@pdr-smt.comNorth AmericaPDR America6320 Belleau Wood Lane, Suite 3Sacramento, CA 95822USASalesPhone: (916) 395 5595Toll Free: (877) 700 6085Fax: (916) 395 5597Email: sales@pdr-america.comA full list of PDR distributors offeringprofessional sales and support can befound at www.pdr-smt.com/contacts.Major Advantages No nozzles, focus hoods or shieldsAny shape or size component covered Low cost of ownershipNearly zero follow-on costs Fully modular and upgradeableEasily configured to meet any requirements Precise, focused component heatingIR, with no effect on adjacent components Excellent control software and mechanicsWith non-contact, component temperature sensing Easy to set up and useClean, simple, 100% yield processFor full detailed features and specifications on the PDR IR-X410 visitwww.pdr-smt.com/x410Simple BGA Rework ProcedureBGA rework poses the problem of accessing hiddeninterconnects in a high density environment. Consequently, itrequires a system that is able to access the hidden jointswithout affecting neighbouring components. A system that issafe, gentle, adaptable and, above all, simple to operate.The IR-X410 is such a system. It is so easy to operate thattechnicians are able to instantly achieve excellent processcontrol for BGA/SMT rework without the complexities andfrustrations normally associated with high end reworksystems.With the aid of excellent mechanics, optics and control,operators can simply pick up the BGA from the nest, align it,place it into fluxed pads and reflow with the systems accuratePC based, closed-loop component and PCB temperaturecontrol.BGA AlignmentPlacementReflowPDR ThermoActive SoftwareAuthorised DistributorDetailed Features and Specifications Advanced Focused IR Component HeatingLens Based Focused IR heating with adjustable image systemPDR lens attachments with IR image from 4 to 70mm diameterReworks all SMDs/ BGAs including 0201s + lead free applications Large Area IR PCB Preheater Systemmedium wave IR PCB preheating1200W (2 x 600W switchable)2 zones (inner - 120mm x 300mm area) and (inner+outer - 240mm x 300mm area) PDR Lens AttachmentsF150 (4 -18mm spotsize) optionalF200 (10 -28mm ) optionalF400 (12 -35mm ) optionalF700 (25 -70mm ) standard Precision Component Placement SystemVacuum operated pick and place with precise macro-micro Z axis movementMicrometer control for soft component landing360 component rotationComponent nest and print frame facility for paste application Macro-Micro X/Y PCB TablePrecision micrometer (Micro) control+/- 10 microns (.0004) movement in X/Y directionsMacro override facility in all directionsUp to 17 X 20 (420mm X 500mm) capacity with lockable XY axis Non-contact, IR Sensor for measuring component temperatureManually adjustable, K-type non-contact IR sensorRealtime monitoring of component temperature throughout process K-Type, contact probe for measuring PCB temperatureManually attached, K-type thermocouple contact probeRealtime monitoring of PCB temperature throughout process PC Control Package with PDR ThermoActive V3 Software SuiteType 5, Digital controller with multi functional featuresMulti K-type thermocouple (x4) capacity for temp/time testingAdvanced, Windows 98/me/XP/NT ThermoActive V3 software suiteRealtime, closed loop component/PCB temperature controlDrag and drop profile settingTemperature profiling and data logging Optional - Prism based BGA/micro-BGA alignment systemSplit beam prism system for simultaneous PCB/component viewingBGA, CSP and leadless component alignmentIntegral LED lighting system with illumination level controlFull colour 1/2 CCTV camera and 15 TFT/LCD Flatscreen colour monitorComputar zoom lens with up to X50 magnificationPrecise X/Y axis mounting systemBenchtop RequirementsTopheat power - 150 watts IRBackheater power - 600W or 1200 watts IRVoltage/frequency - 110/240 volts 50/60HzTypical components - CSPs, BGAs, micro-BGAs, QFPs, PLCCs, SOICs, small SMDs Bench area required - 1400mm x 600mmWeight - 65 KgPDR reserves the right to improve or change specifications without giving notice.X410 Technical Specifications

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