PDR IR-E3 Evolution BGA Rework System - PDR IR-E3 Evolution BGA Rework System • Advanced Focused IR component heating 150W, lens based Focused

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    02-Apr-2018

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PDR IR-E3 EvolutionBGA Rework SystemPDRs Focused IR SMT/BGA Rework Systemfor Ultimate Performance in BGA ReworkPDR IR-E3 Evolution BGA Rework Systemwww.pdr-rework.comAdvanced features available FocusedIRcomponentheating PDRspatentedtool-freeIRtechnology QuartzIRPCBpreheater Largearea2000wIRheating Optional750w,1600wor2400w AdvancedPrecisioncomponent pickandplacement Liftfromcomponentnestpluslowforcelanding androtation Componentnest/fluxapplicationfacility Usingfluxdiptrayorcomponentprintframe PrecisionX/YPCBtable Macro-Micromovementandmicrometer adjustment Auto-profileprocesscontrolpackage WithPDRsThermoActiveV4+softwaresuite BGA/BGAalignment Highmagnification,CCTV/prismbasedsystem AuxiliaryProcessCamera(Optional) Highmagnification,CCTV/prismbasedsystem Non-contactcomponent temperaturesensing Realtimemeasurementofcomponent temperatures PrecisionPCBtemperaturesensing Contactornon-contacttemperaturesensors AutoLiftPick-Up(Optional) Automaticremovalofcomponent PCBCooling(Optional) ForfastcoolingofLED-FreeassembliesBGAreworkwithoutthecomplicationsThePDRIR-E3SMT/BGAreworksystem,usingPDRspatentedFocusedIRtechnology,hasbeenspecificallydesignedtocopewiththechallengesofrepairingtodaysPCBassemblies.Thesystemistoolfree,gasfree,instantly/preciselycontrollable,clean,modular,upgradeableandproduces100%yieldBGAreworkwithoutanycomplications.Itprovidestheextremelyhighlevelsofprofilingandprocesscontrolnecessaryfortheeffectivereworkofeventhemostadvancedpackages,includingSMDs,BGAs,CSPs,QFNs,Flipchipsandisreadyfor0201andlead-freeapplications.TheIR-E3canbeeasilyconfiguredtoyourrequirements,withagoodrangeofadvancedfeaturestochoosefrom,allowingtheoperatortoquicklyandsafelyreworkalltypesofcomponentswithoutoverheatingthecomponent,adjacentsorthePCB.ItusesalltheprovenattributesofPDRsFocusedIRtechnology,firstintroducedin1987andnowusedworldwidebyover4000customers.SimpleBGAreworkprocedureBGAreworkposestheproblemofaccessinghiddeninterconnectsinahighdensityenvironment.Consequently,itrequiresasystemthatisabletoaccessthehiddenjointswithoutaffectingneighbouringcomponents.Asystemthatissafe,gentle,adaptableand,aboveall,simpletooperate.TheIR-E3issuchasystem.ItissoeasytooperatethattechniciansareabletoinstantlyachieveexcellentprocesscontrolforBGA/SMTreworkwithoutthecomplexitiesandfrustrationsnormallyassociatedwithhigh-endreworksystems.Paste-Place-ReflowWiththeaidofexcellentmechanics,opticsandcontrol,operatorscansimplypickupthefluxedBGAfromthenest,alignit,placeitontothePCBspadsandthenreflowwiththesystemsaccuratePCbased,closedloopcomponentandPCBtemperaturecontrol.PDR IR-E3 Evolution BGA Rework Systemwww.pdr-rework.comAdvancedFocusedIRcomponentheating 150W,lensbasedFocusedIRheatingwithadjustableimagesystem PDRlensattachmentswithIRimagefrom4to70mmdiameter ReworksallSMDs/BGAsincluding0201s+leadfreeapplicationsQuartzIRPCBpreheating Highpower,mediumwavequartzIR Standard2000W,2x1000Wzones(240mmx240mmarea) Optional750W,singlezone(120mmx120mmarea) Optional1600W,2x800Wzones(240mmx240mmarea) Optional2400W,2zones,800w+1600W(240mmx360mmarea)PDRlensattachments F150(4-18mmspotsize)optional F200(10-28mmspotsize)optional F400(12-35mmspotsize)optional F700(25-70mmspotsize)standardAdvancedProfessionalvacuumplacementsystem Withprecisepickandplaceaction,Y/Zaxismovementand rotationsoftcomponentlandingandZ-axisstopforplacement inpaste Interchangeablepick-upheadsfordifferentapplicationsComponentnestforprecisioncomponentpick upandFluxapplication Withcomponentprintframe,diptray,orministencilpaste-head facilityforfluxandsolderpasteapplicationPrecisionmacro-microX/YPCBtable Precisionmicrometer(micro)X/Yandmicrorotationcontrol +/-10microns(.0004)movementinX/Ydirections MacrooverridefacilityinX/Ydirections Upto12X18(300mmX450mm)capacitywith lockableX/YaxisComponenttemperaturesensing Non-contact,IRsensor Manuallyadjustable,K-typenon-contactIRsensor Realtimemonitoringofcomponenttemperature throughoutprocessPCBtemperaturesensing Contactoroptionalnon-contactsensors Manuallyattached,K-typethermocouplecontactprobe,or manuallyadjustable,K-typenon-contactIRsensor RealtimemonitoringofPCBtemperaturethroughoutprocessDetailsandspecificationsofadvancedfeaturesavailableAutoprofileprocesscontrolwith PDRThermoActivesoftwaresuite Type5,digitalcontrollerwithmultifunctionalfeatures Advanced,WindowsXP/Vista/NTThermoActiveV4+softwaresuite Twochannel,realtime,closedloopcomponentandPCB temperaturecontrol Auto-profiletemperatureprofilinganddatalogging MultiK-typethermocouple(x4)capacityfortemp/timetestingCCTV/prismbasedBGA/uBGAalignmentsystem Splitbeamprismsystemforsimultaneous PCB/componentviewing BGA,CSPandleadlesscomponentalignment IntegralLEDlightingsystemwithilluminationlevelcontrol Fullcolour1/2CCTVcameraand17TFT/LCDFlatscreen colourmonitor HighqualityzoomlenswithuptoX50magnification PreciseX/YaxismountingsystemAuxiliaryprocessobservationcamera(optional) IntegralLEDlightingsystemwithilluminationlevelcontrol Fullcolour1/2CCTVcameraand17TFT/LCDFlatscreen colourmonitor HighqualityzoomlenswithuptoX40magnificationBenchTopRequirementsTopheatpower 150WIRBackheaterpower 750W,1600W,2000Wor2400WIRVoltage/frequency 220-240volts50/60Hz,upto2.6KWTypicalcomponents CSPs,BGAs,uBGAs,QFNs,QFPs,PLCCs,SOICs,smallSMDsBencharea 1400mm(w)x600mm(d)Weight 65KgTheabovefeaturesaremostlyoptionalandalso,PDRreservestherighttoimproveorchangespecificationswithoutgivingnotice.PDR IR-E3 Evolution BGA Rework Systemwww.pdr-rework.comPDRPioneersofFocusedIRtechnologyIn1986,PDRpioneeredtheuseofFocusedInfra-Redtechnologyforreworkapplications.Today,over4000systemshavebeeninstalledaroundtheworldatOEMsandEMSprovidersactiveinthedefence,aerospace,automotive,avionics,telecomsandcomputerindustries.CompaniessuchasNASA,Boeing,Nokia,Alcatel,Sony,Motorola,Philips,Dell,IBMandEADS,tonamebutafew,relyeverydayonPDRsFocusedIRtechnologytodeliversimple,safeandrepeatablerework.Withtheevolutionofincreasinglycomplexboards,theongoingminiaturisationofcomponentsandlead-freesolders,PDRsFocusedIRtechnologyisrapidlysupersedinghotgasastheplatformofchoiceforOEMsandEMSproviders.HighlevelsofprofilingandprocesscontrolmakeFocusedIRtheperfectchoicetohandlethenarrowerprocesswindowoflead-freeanddeliverthe100%yieldmanufacturersdemand.PDRsFocusedIRdelivers100%yieldBGAreworkPDRsFocusedIRreworksystemsprovidehighqualityresultsonbothstandardandfine-pitchcomponents,arraypackagesandalllead-freedevices.FocusedIRisabletopinpointthesmallestcomponentinahigh-densityenvironmentandprovidetheoperatorwithaclearviewofboththePCBandthecomponentthroughouttheprocess,makingthisthebestchoiceforallreworkapplications.PDRsprocessinvolvespre-heatingthePCBfrombelowwithabackheaterandthenheatingthecomponentfromabove.Thisreducesthetimeandenergyrequiredfortopsideheating,therebyminimisingthepotentialfordamagetothecomponent,thePCBoradjacentdevices.PDRsclosedlooptemperaturemonitoringsystem,withanon-contactIRsensor,makestheprocesshighlycontrollableandrepeatable,producinghighqualitysolderjointseverytime.PDRsystems-flexible,modularandupgradeablePDRsversatilesystemsrangefromaFocusedIRhandtoolrightthroughtosemi-automated,advancedreworkstations.Theyalsoincludesystemsdesignedspecificallyforsmalltolargeapplications.EachFocusedIRsystemoffersanexcellentlevelofstandardfeatures,plusoptionstosuiteverybudget.PDRssystemsaremodularandeasilyupgraded,allowingyoutoaddtheextrafunctionalityyouneedasyourrequirementschange.PDR IR-E3 Evolution BGA Rework Systemwww.pdr-rework.comTheadvantagesofFocusedIRFocusedIRcomponentheatingPrecisecomponentheatingeliminatestheriskofdamagetothePCB/adjacentsNonozzles,focushoodsorshieldsAsimpleturnofthelensallowsforeasyreworkofanysize/shapecomponentLowcostofownershipCompetitivesystempricingandnearlyzerofollow-oncostsModularandupgradeablesystemsEasilyconfiguredtomeetanyrequirementsasyourdemandsexpandExcellentcontrolsoftwareNon-contact,componenttemperaturesensingandautomaticthermalprofilingEasytoset-upanduseClean,simpleandsafe.Easeofusedelivers100%yieldThebestBGAreworksystemsintheworldForovertwentyyearswehavecontinuallypushedtheboundariesofrefinedreworksystems.Ourcleanandintuitiveheatingtechnologycombineswithitsunmatchedcontrolandsolderingability,tobecomeoneofthemosteffectiveinnovationsinourindustry.AnotherdevelopmentfromPDRisourhighresolutionCCTV/splitbeamprism-basedBGAalignmentoption,whichallowstheoperatortoviewthePCBandcomponentsimultaneouslywithacolourvideomonitorandzoomlens.AddtothisPDRssuperbprecisionmechanics,whichprovideoperatorswithvacuum-operatedpickup,macro-microZaxis,360componentrotationandmicrometercontrolforsoftcomponentlanding,andyouhaveunbeatablereworksystemsthatprovide100%yieldonallSMT/BGAreworkapplications.Leading-edgecontrolsoftwareAmajoradvantageinchoosingPDRsFocusedIRreworksystemsistheThermoActiveV4+autoprofilingsoftwaresuite.Ithasbeendesignedtobeasuser-friendlyaspossible,withexcellentgraphicsandsimple,logicalcontrols.TheoperatorsetsthetemperaturetargetandtheThermoActiveV4+softwaremanagestheheatingprocess,ensuringthattheheatappliedtothePCBandcomponentisprecise.Particularlybeneficialforthedemandsoflead-free,thermalprofilesfordifferentassembliescanbeautomaticallycreatedwithinminutesandstoredforfutureuse.PDRPDR-DesignandManufacturingUnit3StanleyCentre,KelvinWayCrawley,WestSussex,RH109SE,EnglandT:+44(0)1293614000F:+44(0)1293613600E:sales@pdr.co.ukPDR America - Sales/Support Center3869DividendDrive,ShingleSprings,CA95682,USAT:(530)6766262F:(530)6766265E:sales@pdr-america.comPDRsproductsareavailableworldwideviaourinternationaldistributors,allofferingprofessionalsalesandsupport.Forcontact,productandcompanydetailspleasevisitwww.pdr-rework.comwww.pdr-rework.com

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