BGA Rework Stencils - Farnell Rework Stencils Description If you’ve been using metal stencils for BGA rework, we have some great news for you. Flextac BGA Rework

  • Published on
    02-Apr-2018

  • View
    216

  • Download
    3

Transcript

  • BGA Rework Stencils

    DescriptionIfyouvebeenusingmetalstencilsforBGArework,wehavesomegreatnewsforyou.FlextacBGAReworkStencils...acreativenewproductthatisamajorimprovementoverwhatyoumaybeusingnow.Theseflexiblesolderpastestencilsarelasercutfromhighquality,antistaticpolymerfilmwitharesiduefreeadhesivebacking.Becausetheyareselfsticking,notapeorfixturingisneeded.TheadhesivesealsaroundeachBGApadtopreventsolderpastefrombleedingunderthestencilwhenthepasteisapplied.FlextacStencilsareeasytouseandleavenoresidueontheboardsurface.TypicalBGAreworkstencilsaremadefrommetalandrequirefixturingortapingtopositionthemandholdtheminplace.Metalstencilswarpeasily,andifthecircuitboardhasundulationsintheboardsurface,themetalstencilwillnotsitflat.Sincethereisnogasketlikeseal,solderpastecaneasilybleedundermetalstencilswhenpasteisappliedwithasqueegee.Alsosolderpastecanspilloutoverthesidesofflatmetalstencilscontaminatingthecircuitboardsurface.Metalstencilsrequiretediousstencilcleaning.Tousemetalstencilseffectively,ahighlevelofoperatorskillisrequired.How Flextac Stencils WorkYoufirstfoldtheprescoredsidetabsandthenpeelofftheprotectivecoverfilmfromthebottomsideofthestencil.HoldsthesidetabswhileplacingtheFlextacStencilinpositiononthecircuitboardsurface.Ifthestencilisnotcorrectlypositioned,youcansimplyrepositionit.Thesidetabsalsoserveassolderdamspreventingsolderpasteoverspill.Noexternaltapingorfixturingisused.Younextapplyasmalldabofsolderpasteandusesastandardsqueegeetospreadthepaste.SincetheresiduefreeadhesivesealsaroundeachBGApad,youcanmakeasmanypasseswiththesqueegeasneededtoassureproperaperturefilling.TheFlextacStencilisthenpeeledupleavingaperfectdepositofsolderoneachpad.AlthoughFlextacStencilsaredisposable,theycanbeusedseveraltimes.

    Application

    ApplyingsolderpasteforBGArework.

  • Features and Benefits

    ResiduefreeadhesivebackingsealsaroundBGApadstopreventsolderpastebleed. Lasercutensurespreciseaperturesize. Disposableeliminatestediousstencilcleaning. Flexibleconformstoboardsurface. Foldupsidesforeasyplacementandsolderpastecontainment. Lowcost. Wideselection. PackagedinahandyESDsafecarryingcase

    Specifications

    Material: AntistaticPolymerFilm

    Adhesive: ResidueFree(ExceedsBELCORES.I.R.GR78CORE)

    FlextacBGAReworkStencilKit(clicktobuy)ispackagedinaruggedESDsafecase.

    TheKitincludes20differentsizesofBGAreworkstencils,aspatulahandleandthreesizesofspatulablades.

  • Step1:Selectthepropersizeandfoldupthesidetabs.

    Step2:Peeloffthecoverfilmexposingtheadhesivebacking

    Step3:Placeinpositionusingthehandysidetabs.

    Step4:Applypasteusingastandardmetalsqueegee.

    Step5:Removethestencilandsaveforanotherreuseordispose.

    Note:Allpartnumberslistedbelowaresoldinpackagesof10.

  • 0.65mm(.0256")Pitch

    BallCount

    GridSize&BallPattern

    Thickness(in)

    Thickness(mm)

    HoleDiam.(in)

    HoleDiam.(mm)

    ComponentBody

    Description

    336 14x14,FullArray .004"(0.102mm)

    .020"(0.508mm)

    14mmx14mmST3369BG0201

    0.80mm(.0315")Pitch

    BallCount

    GridSize&BallPattern

    Thickness(in)

    Thickness(mm)

    HoleDiam.(in)

    HoleDiam.(mm)

    ComponentBody

    Description

    280 16x16,FullArray .004"(0.102mm)

    .017"(0.432mm)

    16mmx16mmST2806BG0194

    1.00mm(.039")Pitch

    BallCount

    GridSize&BallPattern

    Thickness(in)

    Thickness(mm)

    HoleDiam.(in)

    HoleDiam.(mm)

    ComponentBody

    Description

    64 8x8,FullArray .004"(0.102mm)

    .020"(0.508mm)

    10mmx13mmST0643BG0084

    196 14x14,FullArray .004"(0.102mm)

    .020"(0.508mm)

    15mmx15mmST1963BG0144

    256 16x16,FullArray .004"(0.102mm)

    .020"(0.508mm)

    17mmx17mmST2563BG0164

    324 18x18,FullArray .004"(0.102mm)

    .020"(0.508mm)

    19mmx19mmST3243BG0184

    32422x22,P4Row,+6x6center

    .004"(0.102mm)

    .020"(0.508mm)

    23mmx23mmST3243BG0224

    484 22x22,FullArray .004"(0.102mm)

    .020"(0.508mm)

    23mmx23mmST4843BG0224

  • 672 26x26,FullArray .004"(0.102mm)

    .020"(0.508mm)

    27mmx27mmST6723BG0264

    676 26x26,FullArray .004"(0.102mm)

    .020"(0.508mm)

    27mmx27mmST6763BG0264

    1657 41x41,FullArray .006"(0.152mm)

    .025"(0.635mm)

    42.5mmx42.5mm

    ST16573BG0416

    1.27mm(.050")Pitch

    BallCount

    GridSize&BallPattern

    Thickness(in)

    Thickness(mm)

    HoleDiam.(in)

    HoleDiam.(mm)

    ComponentBody

    Description

    119 7x17,FullArray .006"(0.152mm)

    .025"(0.635mm)

    14mmx22mmST1192BG07X126

    208 17x17,P4Row .006"(0.152mm)

    .025"(0.635mm)

    23mmx23mmST2082BG0174

    256 16x16,FullArray .008"(0.203mm)

    .032"(0.813mm)

    21mmx21mmST2562BG0168

    256 20x20,P4Row .006"(0.152mm)

    .025"(0.635mm)

    27mmx27mmST2562BG0206

    27220x20,P4Row,+4x4center

    .006"(0.152mm)

    .025"(0.635mm)

    27mmx27mmST2722BG0206

    29220x20,P4Row,+6x6center

    .006"(0.152mm)

    .025"(0.635mm)

    27mmx27mmST2922BG0206

    304 16x19,FullArray .008"(0.203mm)

    .032"(0.813mm)

    21mmx25mmST3042BG16X198

    352 26x26,P4Row .006"(0.152mm)

    .025"(0.635mm)

    35mmx35mmST3522BG0266

    357 19x19,FullArray .006"(0.152mm)

    .025"(0.635mm)

    25mmx25mmST3572BG0196

    361 19x19,FullArray .008" (0.203 .032" (0.813 25mmx25mm ST3612BG019

  • mm) mm) 8

    38826x26,P4Row,+6x6center

    .006"(0.152mm)

    .025"(0.635mm)

    35mmx35mmST3882BG0266

    420 26x26,P5Row .006"(0.152mm)

    .025"(0.635mm)

    35mmx35mmST4202BG0266

    432 31x31,P4Row .006"(0.152mm)

    .025"(0.635mm)

    40mmx40mmST4322BG0314

    560 33x33,P5Row .006"(0.152mm)

    .025"(0.635mm)

    42.5mmx42.5mm

    ST5602BG0336

    624 25x25,FullArray .008"(0.203mm)

    .032"(0.813mm)

    32.5mmx32.5mm

    ST6242BG0258

    625 25x25,FullArray .008"(0.203mm)

    .032"(0.813mm)

    32.5mmx32.5mm

    ST6252BG0258

    1.50mm(.059")Pitch

    BallCount

    GridSize&BallPattern

    Thickness(in)

    Thickness(mm)

    HoleDiam.(in)

    HoleDiam.(mm)

    ComponentBody

    Description

    225 15x15,FullArray .006"(0.152mm)

    .025"(0.635mm)

    27mmx27mmST2251BG0156

Recommended

View more >