- Analysis of PC Chip Heat Sink Design Royce Tatton ME 340 Dr. Solovjov Fall 2006.
Analysis of PC Chip Heat Sink Design Royce Tatton ME 340 Dr. Solovjov Fall 2006.
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- Analysis of PC Chip Heat Sink Design Royce Tatton ME 340 Dr. Solovjov Fall 2006
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- The Problem Problem 3.137 in Incropera and DeWitt Comparison of two fin arrays to be used as PC chip heat sink Which provides more heat transfer (better cooling)?
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- The Chip Material Ceramic Porcelain Dimensions 53 X 57 X 10 mm Temperature 75 C Maximum
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- Design A Dimensions 3 X 3 X 30 mm Number 6 X 9 array (54 total) Material 6061 Aluminum Convection Coefficient 125 W/m 2 K
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- Design B Dimensions 1 X 1 X 7 mm Number 14 X 17 array (238 total) Material 6061 Aluminum Convection Coefficient 375 W/m 2 K
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- Methods Use COSMOSWorks 2006 to determine maximum flux and temperature distribution in Design A and Design B Compare to analytical results
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- Setup of Problem Simplify by reducing to of the total geometry along symmetry planes Apply temperature constraints to chip surfaces Apply convection loads to top chip surface and fins
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- Results Design A Maximum chip temperature of 75C (348.15 K) Resultant heat flux of 7.807E+5 W/m 2 Temperature PlotHeat Flux Plot
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- Results Design B Maximum chip temperature of 75C (348.15 K) Resultant heat flux of 1.002E+6 W/m 2 Design B provides greater cooling of chip Temperature PlotHeat Flux Plot
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- Conclusions Design B provides better cooling to the chip Results agree with the results of the problem in the textbook Conduction coefficient very significant factor Bigger is not always better
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- Recommendation Always perform heat transfer analysis before making decision on intuition Further analysis with radiation and other materials to find a better fin design